Tenstorrent에서 고급 반도체 패키지 설계를 담당할 엔지니어를 채용합니다. Cadence Allegro를 활용한 PCB 설계 및 SI/PI 모델링 경험이 필수입니다. 초기 단계의 패키지/보드 공동 설계에 집중하며, 고밀도 BGA 및 복잡한 연결성 문제를 해결합니다. AI 기술 혁신을 선도하는 팀에서 협업하며 성장할 기회입니다.
United States
Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities.
We are seeking a designer to create board-level routing studies, design mock-ups, and SI/PI modeling collateral that support advanced semiconductor package development. This role is focused on early-stage package/board co-design rather than production PCB release. The designer will work closely with signal integrity, power integrity, mechanical, and system teams to develop representative PCB routing environments for BGA optimization, package escape studies, and system-level electrical modeling.
This role is hybrid, based out of Santa Clara, California, Austin, Texas, Toronto Canada or New Taipei City, Taiwan.
We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.
Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.
Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.
This offer of employment is contingent upon the applicant being eligible to access U.S. export-controlled technology. Due to U.S. export laws, including those codified in the U.S. Export Administration Regulations (EAR), the Company is required to ensure compliance with these laws when transferring technology to nationals of certain countries (such as EAR Country Groups D:1, E1, and E2). These requirements apply to persons located in the U.S. and all countries outside the U.S. As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency. If employment is not possible due to U.S. export laws, any offer of employment will be rescinded.
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