인텔에서 실리콘 패키징 설계 엔지니어를 채용합니다. 기판 설계 및 레이아웃 툴(Cadence APD/Mentor Xpedition) 활용 능력이 필수입니다. 전체 기판 설계 프로세스를 주도하며 성능과 비용을 최적화하는 역할을 수행합니다. 관련 분야 학사 학위와 3~4년 이상의 경력이 필요하며, 하이브리드 근무가 가능합니다.
As a Silicon Packaging Design Engineer, you will play a crucial role in driving the end-to-end development of innovative substrate designs. Your expertise will directly impact the performance, cost, and manufacturability of our products, helping Intel maintain its leadership in the semiconductor industry. Working collaboratively with cross-functional teams, you will have the opportunity to optimize silicon-package-board interfaces and contribute to groundbreaking advancements in technology.
Key Responsibilities include but not be limited to:
Drive the entire substrate design process, from design through tapeout, with a focus on performance, manufacturability, and cost optimization.
Implement the physical layout and routing of package designs using design tools and methodologies and meeting the design requirements.
Conduct substrate fit and routing studies to evaluate design, performance, and cost tradeoffs.
Documenting the detailed design requirements clearly in the Package Design Requirement Document.
Collaborate closely with silicon and hardware teams to optimize silicon-package-board performance and pinout.
Understand and apply substrate design rules to ensure design quality and compliance.
Conduct internal and external design reviews and resolve design rule checks (DRCs) to achieve optimal package design.
Continuously improve in the package design work either by coming up with innovations or driving efficiencies that helps improve cost, schedule and/or quality for the design that ultimately add value to our company.
Bachelor's degree in Electrical Engineering, Mechanical Engineering, Electronics, or a related field.
At least 4 years of experience in substrate/package design with a Bachelor's degree, 3 years with a Master's degree, or no experience required with a PhD.
Proficiency in substrate layout and routing tools such as Cadence APD or Mentor Xpedition.
Experienced in using Electrical Design Analysis software tool.
Strong understanding of substrate design rules, DRC resolution, and package-board interface optimization.
Experience with data analysis and design documentation tools.
Familiarity with substrate manufacturing and assembly process.
Familiarity with high-speed signal integrity, power delivery.
Demonstrated excellent problem-solving and analytical skills.
Strong collaboration and effective communication skills, with experience working in cross-functional teams and provide feedback to stakeholders.
Passion for innovation and continuous learning in a fast-paced, dynamic environment.
Join Intel and be part of an industry-leading team where your contributions will have a lasting impact. Apply today to take the next step in your engineering career.
Experienced Hire
Shift 1 (Malaysia)
Malaysia, Penang
Malaysia, Kulim
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
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This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
