공학, 물리학, 화학 등 관련 분야 석사 학위와 1년 이상의 경험 또는 박사 학위와 6개월 이상의 경험이 필수예요. 제품 패키징 조립 공정, SPC, DOE, DFM 실무 경험을 반드시 갖춰야 해요. 업무는 현장 상주가 필수이며, 패키징 솔루션 설계와 개발, 공정 효율 개선 및 공급망 협업을 수행해요. 팀 규모나 보고 체계는 명시되지 않았어요.
The Role and Impact
As a Packaging Module Engineer, you will play a pivotal role in shaping Intel's advanced packaging solutions that directly impact the delivery, performance, and sustainability of cutting-edge products. By applying scientific and engineering principles, you will design and develop innovative packaging solutions that ensure the secure transportation and optimal performance of Intel's products globally. Joining Intel means contributing to groundbreaking projects, collaborating with industry-leading teams, and driving advancements that align with Intel's mission to deliver world-class technology solutions. This role will empower you to influence manufacturing processes, enhance efficiency, and support Intel's growth in the competitive semiconductor industry.
Design, develop, and qualify packaging solutions and materials that meet product and regulatory requirements.
Lead packaging development processes, including artwork creation, concepts, prototypes, qualification testing, and specification documentation.
Collaborate with manufacturing, logistics, regulatory, and supply chain partners to ensure packaging solutions meet operational needs.
Identify and implement cost-saving, waste-reduction, and efficiency improvement measures for packaging processes.
Conduct risk analysis to ensure packaging solutions comply with regulations and align with Intel's quality standards.
Consult with cross-organizational teams on branding, marketing, SKUs, labeling, and bills of material requirements for shipments into Intel's distribution channel.
Evaluate and qualify vendors to ensure high-quality packaging manufacturing startup and scalability.
Benchmark packaging designs and processes against industry standards to maintain a competitive edge.
Document and maintain technical specifications for packaging solutions to ensure consistency and clarity.
Demonstrated problem-solving skills in packaging development or manufacturing.
Effective communication skills to collaborate with cross-organizational teams and external vendors and customers
Intel invests in our people and offers a complete and competitive package of benefits employees and their families through every stage of life.
See Intel Benefits for more details.
Qualifications
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Intel U.S. Immigration Sponsorship Information
Minimum Qualifications and Experience:
Possess a Master's degree in Engineering, Physics, Chemistry, or a related STEM field with 1+ years of educational or work experience. Or a PhD degree in the same fields with 6+ months of educational or work experience.
Your experience described above must be in the following:
Product packaging assembly processes and production methodologies.
Statistical process control (SPC) principles and design of experiments (DOE) techniques.
Analytical skills with proficiency in data analysis and risk assessment methods.
Design for manufacturing (DFM) practices and packaging test criteria.
Preferred Qualifications and Experience:
Experience with Surface Mount Technologies, solder joint formation/quality/reliability, and package certification methodologies.
Experience leading technical teams, influencing stakeholders, and managing resources and timelines in a matrixed environment.
Familiarity with semiconductor device fabrication processes and packaging process flows.
A track record of delivering results in time-critical technical projects involving innovation and strategic planning.
Apply problem-solving techniques and fundamental engineering concepts to create novel, efficient solutions.
We are looking for individuals who are passionate about engineering excellence and sustainability. Apply today to help drive Intel's global impact through innovative packaging solutions.
Experienced Hire
Shift 1 (United States of America)
US, Arizona, Phoenix
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
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We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $99,030.00-188,890.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
