Intel에서 패키징 모듈 개발 엔지니어를 채용합니다. 전자 패키징 및 공정 개발 분야에서 5년 이상의 경력이 필수입니다. DOE, SPC, FMEA 등 공정 최적화 역량을 갖춘 분을 찾습니다. 신제품 및 테스트 차량의 공정 개발과 양산 이관을 주도하게 됩니다. 말레이시아 쿨림 현장에서 근무하며, 반도체 패키징 기술 혁신에 기여할 전문가를 기다립니다.
Process Development Engineer Role in Solder Ball Attach or Chip Attach Process in Technology Development Organization
CAM/SLAM Process covers Die and DRAM Attach, Component Attach, Solder Ball Attach and Deflux Process
Candidate will focus on Process and Technology Development for Electronic packaging assembly process on New Product and Test Vehicle
Technical knowledge in Research and Development, Process Development, Process Engineering, Design of Experiment (DOE), Statistical Process Control (SPC), Failure Modes/Effects Analysis (FMEA), Quality, Yield Improvement, Optimization
Pathfinding, developing, qualifying, and ramping materials to transfer to high volume manufacturing process in factories.
Develops process specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
Conducting fundamental studies and performing experiments to characterize materials, process, identify potential failure modes, understand the performance interactions, optimization, assess feasibility of technology use on product, and make technology recommendations.
Collaborating closely with other cross-functional team to build material technologies on test vehicles and products and assessing their performance.
BEng/MEng/MSc/PhD degree in relevant engineering disciplines (Mechanical, Materials, Chemical, Electrical, Physics, Mechatronics),
Research and Development background from MSc/PhD is preferred.
5 years working experience in electronic packaging AND/OR development experience is required.
Research and Development background and experience in Chip Attach, Deflux or Ball Attach Process.
Excellent influencing, written and verbal communication skills.
Strong data analysis capabilities and problem solving skills.
Proactive and positive approach towards challenges.
Able to work under tight timelines and schedules, and perform under pressure.
Experienced Hire
Shift 1 (Malaysia)
Malaysia, Kulim
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
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This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
