퓨리오사AI에서 Hardware - Thermal Engineer를 채용합니다. NPU/ASIC 시스템의 열 설계(Thermal Design) 및 CFD 시뮬레이션을 주도하며, 쿨링 솔루션 검증과 신뢰성 테스트를 수행합니다. 열 해석(CFD) 역량과 시스템 설계 경험이 필수입니다. GPU/NPU 카드 개발 경험자를 우대하며, 유관 부서와의 원활한 협업 능력이 중요합니다.
Define end-to-end thermal design across NPU/ASIC package → PCB → card (PCIe FHFL/HHHL, OAM, SXM) → system (server chassis) levels, selecting and designing heatsinks, heat pipes, vapor chambers, cold plates, and TIM
Evaluate trade-offs across cooling approaches — air, liquid, 2-phase, and immersion — and run CFD simulations (FloTHERM, Icepak) including EM-thermal co-simulation using power maps from HFSS/SIwave/PowerDC
Validate thermal performance through wind tunnel testing, hands-on temperature measurement (thermocouples, IR cameras, RTDs), and DOE-based simulation-to-measurement correlation
Support reliability testing including thermal cycling and burn-in
Partner with electrical, mechanical, and manufacturing teams to integrate thermal solutions into packaged hardware, and negotiate thermal specifications with OEM/ODM and hyperscale customers
Author thermal design guides, reference designs, and test reports, and ensure compliance with form-factor standards (OCP OAM, PCIe CEM, NVIDIA SXM, etc.)
Minimum Qualifications
Thermal Modeling & Simulation: Utilize computational fluid dynamics (CFD) to simulate heat transfer and fluid flow.
System Design: Design active and passive cooling solutions, including heatsinks, fans, liquid cooling coldplate.
Thermal Testing: Evaluation for NPU card thermal performance with using multi temp recorder and FLIR camera or thermocouples.
Collaboration: Work closely with electrical, mechanical, and manufacturing teams to integrate thermal solutions into packaged hardware.
Preferred Qualifications
Experienced GPU or NPU card development or server development for datacenter
