Physical Intelligence에서 로봇 데이터 수집을 위한 하드웨어 아키텍처를 설계할 Electrical Engineer를 채용합니다. PCB 설계 및 고속 신호 처리(MIPI) 역량이 필수이며, 3~7년의 경력을 보유한 분을 찾습니다. 로봇 공학의 미래를 함께할 하드웨어 전문가의 많은 지원 바랍니다.
Physical Intelligence is bringing general-purpose AI into the physical world. We are a team of engineers, scientists, roboticists, and company builders developing foundation models and learning algorithms to power the robots of today and the physically-actuated devices of the future.
This role is part of the hardware team, but will involve deep collaboration with the embedded firmware team and the robot software engineering (runtime) team.
- Drive Hardware Architecture: Lead the electrical design of devices crucial to PI’s data collection, from component selection (SoCs, Sensors, PMICs) to final PCBA.
- Imaging System Design: Lead the hardware integration of high-resolution image sensors, ensuring clean power rails and high-speed data paths (MIPI) for optimal image quality.
- Wireless Hardware Integration: Design and optimize RF front-ends for wireless modules, focusing on antenna placement, signal range, and power consumption.
- Schematic & Layout: Take full ownership of schematics and supervise/execute PCB layouts for complex, space-constrained enclosures.
- Hardware Validation: Design and execute test plans to identify hardware bugs, signal integrity issues, and thermal bottlenecks.
- DFM/DFT: Work with manufacturing partners to ensure designs are optimized for high-yield assembly (Design for Manufacturing) and comprehensive on-line testing (Design for Test).
- Power Optimization: Analyze and optimize the hardware-level power consumption for battery-operated devices, and assist with thermal testing and validation of the devices.
In addition to 3–7 years of experience in hardware design and board-level development for high-volume products, strong candidates must have:
- BS/MS in Electrical Engineering or a related technical field.
- PCB Design Expertise: Proficiency in EDA tools (e.g., Altium, Allegro) for complex, multi-layer, high-density interconnect designs, and experience with rigid flex circuits
- Camera System Experience: Hands-on experience with CMOS image sensors, MIPI CSI-2/3 interfaces, and the electrical requirements for high-bandwidth imaging data, including bring-up and image tuning
- High-Speed Design: Deep understanding of signal integrity, power integrity, and EMI/EMC mitigation for high-speed digital and RF circuits.
- Bring-up & Validation: Experience with lab equipment (oscilloscopes, spectrum analyzers, logic analyzers) to lead initial board bring-up, debugging, and hardware validation.
- Power Management: Experience designing efficient power delivery networks (PDN), including DC-DC converters, LDOs, and battery management systems (BMS) for mobile devices.
- Communication Protocols: Familiarity with CAN, Ethernet, SPI, I2C, UART, USB (2.0/3.0/Type-C), and PCIe, as well as wireless protocols including BLE and Wi-Fi (2.4GHz/5GHz), and the ability to evaluate and debug these systems.
- Cross-functional Collaboration: Ability to translate ambiguous product goals into hard functional requirements for firmware, mechanical, and research teams.
Experience with RF/Antenna integration and FCC/CE certification processes
History of working with JDMs and ODMs
Knowledge of flex-circuit (FPC) design and rigid-flex integration
Experience with robotic actuators or motor control circuitry
Understanding of thermal design optimization and testing
Pursuant to the San Francisco Fair Chance Ordinance, we will consider for employment qualified applicants with arrest and conviction records.
