Intel은 어셈블리 패키징 공정의 미디어 및 부속품을 개발할 엔지니어를 모집합니다. 기계/재료/전기공학 또는 물리학 학위가 필수이며, SPC 및 DOE에 대한 실무 지식이 필요합니다. AutoCAD와 Solidworks를 활용한 설계 경험이 중요하며, 혁신적인 솔루션을 통해 제조 효율성을 개선하는 역할을 수행합니다.
Develops media and collaterals for assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
Optimizes and improves the efficiency of manufacturing of media and collaterals, developing improvements to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
Develops media and collateral specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
Develops and maintains equipment to evaluate media and collateral solutions under simulated field use conditions, such as heat, humidity, vibration, temperature cycle, and dynamic forces.
Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with media and collateral quality and reliability.
Performs and influences media and collateral design, material selection and prototype development to meet assembly module needs, based on fundamental understanding of failure mechanisms.
Leads efforts towards innovating, problem solving, developing, and continuously improving media and collaterals using experimental design and statistical methods.
Provides consultation concerning design problems and improvements in the assembly packaging process, and responds to customer/client requests or events as they occur.
Delivers standardization in media and collateral qualification, manufacturing prototypes, and methods and continuously engages with packaging technology development and partner engineering groups on process/technology maturity for products towards key risk areas in meeting product milestones.
Possess a Bachelor's or Master's degree in Mechanical Engineering/Material Engineering/Electrical Engineering/Physics related field.
Minimum 2 year+ of experience in fundamental science and engineering concepts in development to create novel solutions, including strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles.
Experience in analytics and design tools in packaging industry like - AutoCAD, Solidworks, etc)
Experience working with Engineering drawing and tolerancing analysis, design rules.
Strong mechanical design software experience (SolidWorks, AutoCAD, etc)
Portfolio of self-completed concept to fabrication project examples Assembly equipment, process, media, and/or collateral experience.
Technical innovation and deliver results for complex, time critical technical projects.
Understanding of semiconductor fabrication processes and technology with technical and analytical skills.
Experienced Hire
Shift 1 (Malaysia)
Malaysia, Kulim
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
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This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
