인텔에서 반도체 패키징 분야의 Dry Etch 공정 개발 엔지니어를 채용합니다. 플라즈마 식각 공정 최적화 및 DOE 설계 역량이 필수이며, 관련 분야 석사 4년 또는 박사 2년 이상의 경력이 요구됩니다. 차세대 2.5D/3D 패키징 기술을 선도하며 공정 효율과 수율을 개선하는 핵심 역할을 수행하게 됩니다.
We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and heterogeneous integration solutions.
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates
Experience listed above should be a combination of the following:
Process development engineering within semiconductor manufacturing, including wafer-level assembly or advanced packaging processes.
Design of Experiments (DOE), process development methodology, statistical process control, and/or manufacturing process improvement.
Experience with plasma etch equipment platforms
Intel is looking for forward-thinking, skilled engineers who are passionate about advancing the boundaries of semiconductor technology. Join us to help shape the future of innovation. Apply now and become a part of Intel's mission to create world-changing technologies that improve lives.
Experienced Hire
Shift 1 (United States of America)
US, Oregon, Hillsboro
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
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We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $133,800.00-255,200.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
