熱圧着ボンディング開発エンジニア
機械エンジニア正社員ミドル · 0〜2年マレーシア出社
熱圧着ボンディング(Thermal Compression Bonding) プロセスの開発および最適化を担当します。関連分野の修士号が必須であり、学士課程で首席卒業(First Class Honours)していることが求められます。半導体組立装置およびプロセスに関する知識が不可欠です。勤務地はマレーシアのクリムで、オンサイトでの勤務となります。
熱圧着ボンディング(Thermal Compression Bonding) プロセスの開発および最適化を担当します。関連分野の修士号が必須であり、学士課程で首席卒業(First Class Honours)していることが求められます。半導体組立装置およびプロセスに関する知識が不可欠です。勤務地はマレーシアのクリムで、オンサイトでの勤務となります。
Join Intel as a Packaging Module Development Engineer for Thermal Compression Bonding module in Advanced Packaging Technology Manufacturing - Technology Development (APTM-TD) department, where you'll play a pivotal role in shaping the future of assembly and packaging technologies.
In this position, you will drive innovation and optimization in Thermal Compression Bonding process for Intel's advanced packaging roadmap, contributing directly to the quality, reliability, and manufacturability of cutting-edge semiconductor packages.
With an emphasis on experimentation, data analysis, and collaboration, you'll support Intel's mission to deliver world-class products that empower global innovation.
This role provides an opportunity to make a meaningful impact on Intel's success and growth in the semiconductor industry.
Develop and optimize assembly processes and equipment to enable Intel's next-generation packaging technologies.
Apply statistical methods and principles of design of experiments (DOE) to establish and improve process specifications.
Analyze process data to identify opportunities for improving quality, yield, productivity, and cost efficiency.
Collaborate with cross-functional teams to ensure manufacturability and reliability of package designs.
Document technical advancements and improvements through white papers and reports.
Minimum Qualifications:
Possess a Master's degree in Mechanical Engineering, Materials Engineering, Electrical Engineering, Electronic Engineering, Chemical Engineering, Physics, or a related STEM field.
Familiarity with semiconductor assembly equipment and processes.
Preferred Qualifications:
PhD degree holders, or Master’s degree holders with less than 2 years of experience in Thermal Compression Bonding process, with First Class Honours required.
Experience with data science tools such as Python, SQL, or JMP.
Proficiency in statistical methods, including statistical process control (SPC) and data analytics.
Fundamental understanding of semiconductor devices and packaging technology.
Mechanical design experience, including CAD tools.
Strong written and verbal communication skills, with the ability to influence and collaborate across teams.
A proactive approach to challenges and the ability to thrive under tight timelines and schedules.
Has direct relevant experience (internship/research project/etc.) to Thermal Compression Bonding process
Experienced Hire
Shift 1 (Malaysia)
Malaysia, Kulim
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
N/A
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.