Intelではパッケージングモジュール開発エンジニアを募集しています。次世代パッケージングプラットフォーム向けのプロセスや装置を開発し、統計的工程管理(SPC)や実験計画法(DOE)を用いて製造効率を最適化します。関連分野の修士3年以上または博士1年以上の経験が必須で、PythonまたはMATLABのスキルが求められます。アリゾナ州フェニックス勤務で、半導体製造環境での実務経験が重要です。
Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
Develops and maintains equipment to evaluate silicon and package technologies under simulated field use conditions, such as heat, humidity, temperature cycle, and dynamic forces.
Ensures manufacturability of physical layout of package design and oversees the cycle of manufactured package processes, procedures and flows.
Establishes material specifications for contract assemblers and raw material vendors and interfaces with supplier quality and procurement teams to ensure material quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods.
Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with packaging quality and reliability.
Sets reliability requirements to meet customer needs and influences design, material selection and process development to meet those needs, based on fundamental understanding of failure mechanisms.
Leads efforts towards innovating, problem solving, developing, and continuously improving equipment and processes using experimental design and statistical methods.
Provides consultation concerning packaging problems and improvements in the packaging process, and responds to customer/client requests or events as they occur.
Delivers standardization in product qualification, manufacturing quality systems, and methods and continuously engages with packaging technology development and partner engineering groups on process/technology maturity for products towards key risk areas in meeting product milestones.
Note: This role requires regular onsite presence to fulfill essential job responsibilities.
You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related STEM field with 3+ years of industry experience
-OR- PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related STEM field with 1+ years of industry experience
Minimum cumulative GPA of 3.5.
Must have the required degree prior to your start date.
Experience listed above should be a combination of the following:
Technology development, including familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE), preferably within semiconductor or advanced manufacturing environments.
Strong experimental background, including hands-on laboratory or prototype development experience.
Experience in programming/script (e.g., Python, MATLAB) development with artificial intelligence and machine learning concepts
College Grad
Shift 1 (United States of America)
US, Arizona, Phoenix
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
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We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $133,800.00-219,550.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
