About the Job
Rebellions designs its own NPUs and is now building the full system around them, from the chip to the board, the server, and the rack. As a Mechanical Engineer, you will own the mechanical and thermal design of the platforms that turn our silicon into deployable AI infrastructure: the chassis, the cooling architecture, and the rack-level integration that determine how much compute we can actually put in a data center. You will work side-by-side with hardware, thermal, and system engineers to take a platform from concept through NPI, EVT, DVT, PVT, and mass production, and you will validate your own designs with hardware in your hands rather than handing them off.
Your immediate focus is our next-generation AI server platform. Over time, the same system-design skills extend across the rack roadmap, including liquid-cooled and high-density deployments.
Responsibilities and Opportunities
- Drive mechanical design of AI server and rack platforms from concept through mass production
- Plan and run empirical thermal experiments, correlate results with simulation, and turn the findings into design decisions
- Perform design verification (DV), root cause analysis, and design optimization to ensure reliability and manufacturability
- Conduct hands-on teardown and competitive benchmarking of leading AI server, GPU, and rack platforms, and translate the findings into original design improvements
- Conduct hands-on DFA evaluations on physical hardware to identify assembly bottlenecks
- Support prototype builds, system integration, and validation for HPC and AI server platforms
Key Qualifications
- Bachelor's degree or higher in Mechanical Engineering or a related field
- Extensive mechanical and/or thermal design, analysis, and validation experience in HPC, server, or consumer electronics systems, with a track record of taking products from concept to production
- Hands-on experience assembling, disassembling, and validating server hardware, including air- or liquid-cooling thermal modules
- Proficiency in 3D CAD software (Siemens NX preferred) and thermal simulation tools (Icepak or FloTHERM preferred)
- Familiarity with DFM and DFA methodologies
Ideal Qualifications
- Proven experience designing thermal/mechanical solutions for HPC products, including CPU, GPU, and NPU platforms
- Hands-on experience designing, validating, or optimizing liquid cooling systems and airflow architecture
- Familiarity with NVIDIA HGX, AMD Instinct, or custom AI accelerator platforms, and with Open Rack/OCP architectures
- Extensive teardown, debugging, and testing experience with rack systems, consumer electronics, or robotics platforms
- Experience with rack-level integration, server bring-up, and validation in data center or high-power thermal test environments
전형절차
- 서류전형 > On-line 인터뷰 > On-site 인터뷰 > Culture-fit 인터뷰 > 처우 협의 > 최종 합격
- 전형절차는 직무별로 다르게 운영될 수 있으며, 일정 및 상황에 따라 변동될 수 있습니다.
- 전형 일정 및 결과는 지원 시 작성하신 이메일로 개별 안내드립니다.
참고사항
- 본 공고는 모집 완료 시 조기 마감될 수 있습니다.
- 지원서 내용 중 허위사실이 있는 경우에는 합격이 취소될 수 있습니다.
- 채용 및 업무 수행과 관련하여 요구되는 법령 상 자격이 갖추어지지 않은 경우 채용이 제한될 수 있습니다.
- 보훈대상자 및 장애인 여부는 채용 과정에서 어떠한 불이익도 미치지 않습니다.
- 담당 업무 범위는 후보자의 전반적인 경력과 경험 등 제반사정을 고려하여 변경될 수 있습니다. 이러한 변경이 필요할 경우, 최종 합격 통지 전 적절한 시기에 후보자와 커뮤니케이션 될 예정입니다.
