About the Job
Rebellions is the first company in the world to productize a UCIe-based die-to-die (D2D) interconnect for AI accelerator, stitching multiple NPU dies into a single chiplet system. As an HSIO Interconnect Subsystem RTL Design Engineer, you will own the RTL of the subsystems that move data between dies — the communication backbone of the chiplet system — rather than the AI compute die itself. You will work side-by-side with the interconnect architect to concretize the microarchitecture of our next-generation D2D subsystem and carry it from spec to working silicon.
Your immediate focus is D2D; over time, the same subsystem-design skills open the door to other high-speed interconnects across the HSIO roadmap.
Responsibilities and Opportunities
- Subsystem RTL Design: design and implement the D2D interconnect subsystem — transaction management and datapath, link-level reliability (retry/replay, CRC, FEC), and built-in test, debug, and monitoring structures (traffic generation/comparison, loopback, per-port counters, performance monitors)
- Microarchitecture Definition: concretize the subsystem microarchitecture together with the architect — including the areas that industry specs leave under-defined
- Standard-Spec-Based Design: design against open D2D standards (UCIe and related specs) and integrate vendor controller/PHY IP through standard interfaces (e.g., RDI/FDI)
- Cross-Functional Collaboration: partner with verification, SoC integration, firmware (register map / control interface), and PSI teams to make the subsystem work in the real system
- Silicon Bring-up: participate in D2D link bring-up and support post-silicon debugging down to RTL simulation when issues go deep
Key Qualifications
- 6–8 years of combined experience in RTL design using SystemVerilog/Verilog (M.S. counted as 2 years, Ph.D. as 4 years toward this total)
- Full Design Lifecycle: proven experience from architecture definition through RTL implementation, tape-out, and silicon bring-up
- High-Speed Link Design: hands-on design experience at the link layer or protocol layer of a high-speed interface (e.g., PCIe, CXL, Ethernet, or a proprietary die-to-die/chip-to-chip link) — prior UCIe experience is NOT required
- Simulation & Debugging: proficiency in logic simulation tools (VCS, Xcelium) with the ability to resolve complex RTL issues
- Quality Toolchain: experience with industry-standard quality flows, including Lint, CDC, DFT, and Synthesis
- Communication & collaboration: strong, collaborative cross-functional work — root-causing a chiplet issue spans architecture, verification, firmware, PSI, and vendor teams, so we value engineers who debug with data rather than blame and own their mistakes honestly
Ideal Qualifications
- UCIe / D2D: direct experience with UCIe or another die-to-die interconnect
- SerDes / high-speed PHY: working understanding of SerDes-based high-speed links — PCS/PMA partitioning, equalization, clock/data recovery, and link training — and the digital logic that interfaces to a SerDes PHY
- Design-for-Debug: building testability and observability into silicon (loopback modes, traffic generators, counters, performance/error monitors)
- Transaction Ordering: outstanding-transaction management, ordering rules, and flow control in AMBA/NoC-based systems
- Vendor IP Integration: integrating third-party controller/PHY IP through standard interfaces (RDI/FDI, PIPE, or similar)
Growth Path
- D2D architecture, from spec to silicon: you will work daily with the interconnect architect on next-generation D2D architecture, and experience standard-spec-based design at a company that actually ships it — from an evolving industry spec all the way to productized silicon
- Beyond D2D: as the HSIO roadmap expands, you can grow into subsystem design for other high-speed IO domains — Ethernet, optical interconnect, and whatever comes next
Note: this role centers on interconnect and communication subsystems. If you enjoy making dies talk to each other reliably at high speed — rather than building the compute die itself — this is the seat.
전형절차
- 서류전형 > On-line 인터뷰 > On-site 인터뷰 > Culture-fit 인터뷰 > 처우 협의 > 최종 합격
- 전형절차는 직무별로 다르게 운영될 수 있으며, 일정 및 상황에 따라 변동될 수 있습니다.
- 전형 일정 및 결과는 지원 시 작성하신 이메일로 개별 안내드립니다.
참고사항
- 본 공고는 모집 완료 시 조기 마감될 수 있습니다.
- 지원서 내용 중 허위사실이 있는 경우에는 합격이 취소될 수 있습니다.
- 채용 및 업무 수행과 관련하여 요구되는 법령 상 자격이 갖추어지지 않은 경우 채용이 제한될 수 있습니다.
- 보훈 대상자 및 장애인 여부는 채용 과정에서 어떠한 불이익도 미치지 않습니다.
- 담당 업무 범위는 후보자의 전반적인 경력과 경험 등 제반사정을 고려하여 변경될 수 있습니다. 이러한 변경이 필요할 경우, 최종 합격 통지 전 적절한 시기에 후보자와 커뮤니케이션 될 예정입니다.
- 채용 관련 문의사항은 아래 메일 주소로 문의바랍니다.
- recruit@rebellions.ai
