Seoul, South Korea

Hybrid

Define end-to-end thermal design across NPU/ASIC package → PCB → card (PCIe FHFL/HHHL, OAM, SXM) → system (server chassis) levels, selecting and designing heatsinks, heat pipes, vapor chambers, cold plates, and TIM
Evaluate trade-offs across cooling approaches — air, liquid, 2-phase, and immersion — and run CFD simulations (FloTHERM, Icepak) including EM-thermal co-simulation using power maps from HFSS/SIwave/PowerDC
Validate thermal performance through wind tunnel testing, hands-on temperature measurement (thermocouples, IR cameras, RTDs), and DOE-based simulation-to-measurement correlation
Support reliability testing including thermal cycling and burn-in
Partner with electrical, mechanical, and manufacturing teams to integrate thermal solutions into packaged hardware, and negotiate thermal specifications with OEM/ODM and hyperscale customers
Author thermal design guides, reference designs, and test reports, and ensure compliance with form-factor standards (OCP OAM, PCIe CEM, NVIDIA SXM, etc.)

Thermal Modeling & Simulation: Utilize computational fluid dynamics (CFD) to simulate heat transfer and fluid flow.
System Design: Design active and passive cooling solutions, including heatsinks, fans, liquid cooling coldplate.
Thermal Testing: Evaluation for NPU card thermal performance with using multi temp recorder and FLIR camera or thermocouples.
Collaboration: Work closely with electrical, mechanical, and manufacturing teams to integrate thermal solutions into packaged hardware.

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