Foveros Direct パスファインディング統合
年収 $141,910〜$269,100オペレーション正社員ミドル · 4年以上Hillsboro出社
半導体パッケージングソリューションと材料の設計、開発、検証を担当します。学士号取得者は6年以上、修士号または博士号取得者は4年以上の関連経験が必須です。オンサイト勤務が求められ、製造やサプライチェーンのパートナーと連携して業務を進めます。ハイブリッドボンディングプロセスの開発経験がある方は優遇されます。
半導体パッケージングソリューションと材料の設計、開発、検証を担当します。学士号取得者は6年以上、修士号または博士号取得者は4年以上の関連経験が必須です。オンサイト勤務が求められ、製造やサプライチェーンのパートナーと連携して業務を進めます。ハイブリッドボンディングプロセスの開発経験がある方は優遇されます。
Discover how your skills and expertise can have a lasting impact on Intel's industry-leading innovations. Apply today to become part of the team shaping the future of semiconductor packaging technology.
Some of the responsibilities will include but not be limited to:
You will apply scientific and engineering principles to design, develop, and qualify packaging solutions and materials used to hold, display, dispense, and safely transport all types of products.
Manage the packaging development process including packaging artwork development, concepts, prototypes, qualification testing, specification documentation, coordination with manufacturing, regulatory, logistics, and supply chain partners, vendor selection and qualification, manufacturing startup, and benchmarking. Identifies and implements processes to drive efficiency, cost, manufacturability, waste reduction, sustainability, logistics, and/or packaging supply chain improvement opportunities.
Consult cross organizational partners on product launch, branding and marketing, SKU, barcodes and labeling, scaling, packaging supply chain, logistics, regulatory and compliance, and bills of material requirements for shipments into Intel's product distribution channel.
Bachelor's degree in engineering, Materials Science, Chemistry, Physics, or a related field, and 6+ years of relevant experience; or
Master's degree in engineering, Materials Science, Chemistry, Physics, or a related field, and 4+ years of relevant experience; or
PhD in Engineering, Materials Science, Chemistry, Physics, or a related field, and 4+ years of relevant experience.
Experience in packaging engineering, process development, and technology innovation.
Experience in thermal, mechanical, and electrical design concepts related to semiconductor packaging.
Expertise in qualification testing, specification documentation, and packaging material certification.
Experience in advanced packaging technology development and strategic supplier management.
Hybrid Bonding Process development or Integration experience.
Experience with leading technology programs and engaging with cross-functional stakeholders.
Experience participating in forums, task forces, or working groups driving defect reduction and process improvements.
Experienced Hire
Shift 1 (United States of America)
US, Oregon, Hillsboro
US, Arizona, Phoenix
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
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We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $141,910.00-269,100.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.