Job Details:

Job Description:

We are a global leader in semiconductor innovation, pushing the boundaries of silicon manufacturing and advanced packaging technology. Our Advanced Packaging Technology and Manufacturing (APTM) organization is at the forefront of next-generation chip solutions, delivering cutting-edge technologies that power the devices of tomorrow. With a culture built on collaboration, engineering excellence, and continuous innovation, we are committed to developing world-class talent and fostering an environment where bold ideas thrive. Our facility in New Mexico, United States serves as a critical hub for technology development and high-volume manufacturing excellence.

We are seeking a talented and driven Process Integration Engineer to join our APTM Silicon Manufacturing Technology Development organization in Albuquerque, New Mexico, United States. In this role, you will play a pivotal part in enabling our advanced packaging manufacturing roadmap by developing and delivering upcoming technology nodes. You will serve as a key technical contributor, bridging process modules, device engineering, yield, and reliability teams to ensure that base die solutions are robust, manufacturable, and aligned with our long-term packaging strategy. This is an exciting opportunity to make a meaningful impact at the intersection of process development and high-volume manufacturing.

Key Responsibilities:

Roadmap Enablement: Lead the development and integration of upcoming advanced packaging technology nodes, ensuring alignment with the APTM packaging roadmap and strategic manufacturing objectives
Cross-Functional Collaboration: Partner closely with process module teams, device engineering, yield, reliability, and internal and external stakeholders to develop and deliver comprehensive base die solutions
Defect & Yield Management: Own and drive closure of defect, yield (shipped and line), reliability, and device entitlement gaps, utilizing data-driven methodologies to identify root causes and implement sustainable corrective actions
Process Development: Lead specific process development initiatives from concept through qualification, ensuring technical rigor and manufacturability at each stage of development
PRI Enablement & Transfer Readiness: Actively support Process Readiness Initiative (PRI) enablement and manage transfer checklist progress to ensure processes are robust, documented, and ready for seamless transition to high-volume manufacturing
Value Engineering: Identify and implement cost-effective process solutions through innovative thinking and value engineering principles, contributing to both technical performance and business competitiveness
Technology Transfer: Collaborate with manufacturing teams to ensure successful knowledge transfer, process stability, and continuous improvement post-transfer

As a successful candidate, you must possess

Collaborative Spirit — You thrive in team environments and naturally build strong working relationships across diverse groups and disciplines
Effective Communication — You convey complex technical concepts clearly and confidently to both technical and non-technical audiences
Adaptability — You remain composed and productive in a fast-paced, ever-evolving environment, embracing change as an opportunity
Problem-Solving Mindset — You approach challenges with curiosity, creativity, and a structured, solutions-oriented attitude
Ownership & Accountability — You take initiative, follow through on commitments, and hold yourself to a high standard of excellence
Attention to Detail — You bring precision and thoroughness to your work, ensuring quality outcomes at every stage
Innovative Thinking — You consistently look for smarter, better, and more efficient ways to achieve results

Are you ready to shape the future of semiconductor manufacturing? Join our world-class team in New Mexico, United States, and be part of a mission-driven organization where your expertise will directly influence next-generation packaging technologies. We offer a competitive compensation package, comprehensive benefits, and a dynamic work environment that champions growth, innovation, and collaboration.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

Bachelor's degree in Engineering, Material Science, Physics, or a related specialized field, with 3+ years of relevant experience; or a Master's degree in one of these fields with 2+ years of relevant experience; or PhD in the same fields with no experience. Relevant experience for this position will be:
Process integration, yield analysis, quality management or process development in high-volume manufacturing environments.
Knowledge of semiconductor advanced packaging techniques and flows.

Preferred Qualifications:

3+ years of experience in value engineering and an innovative mindset to identify cost-effective solutions.

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, New Mexico, Albuquerque

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

先端パッケージング技術開発プロセス統合エンジニア

Job Details:

Job Description:

Key Responsibilities:

As a successful candidate, you must possess

Qualifications:

Job Type:

Shift:

Primary Location:

Additional Locations:

Posting Statement:

Position of Trust

Benefits

Work Model for this Role

Job Details:

Job Description:

Key Responsibilities:

As a successful candidate, you must possess

Qualifications:

Job Type:

Shift:

Primary Location:

Additional Locations:

Posting Statement:

Position of Trust

Benefits

Work Model for this Role