Packaging Module Development Engineer

Manufacturing EngineerFull-timeMid-level · 1–3 yearsUnited States, PhoenixOn-site
Statistical Process ControlDesign of ExperimentsPythonMATLABArtificial IntelligenceMachine Learning

Intel is hiring a Packaging Module Development Engineer. You will develop assembly processes and equipment for future packaging platforms, optimizing manufacturing using Statistical Process Control (SPC) and Design of Experiments (DOE). A Master's with 3+ years or PhD with 1+ year of exp

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