Semiconductor Process EngineeringEquipment SupportAdvanced PackagingTechnical TroubleshootingDOEData Analysis
Applied Materials Korea is hiring an Advanced Packaging Process Support Engineer. Candidates must have 3-10 years of experience in semiconductor process engineering or advanced packaging. You will manage KINEX bonding systems, optimize hybrid bonding processes, and provide on-sit
Be the first to hear about new roles at Applied Materials Korea
Follow this company and we'll notify you as soon as new roles are posted.
Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.
What We Offer
Location:
Icheon-Gwango,KOR
You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.
At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.
As a Process Support Engineer (PSE), you'll play a critical role in guiding products through their entire lifecycle, from initial concept to final qualification. You will provide high-visibility customer support through on-site installations, system diagnoses, and the service and repair of complex systems and equipment. PSEs work closely with customers and R&D teams to develop leading-edge processes used to manufacture advanced semiconductor chips, and create hypothesis experiments and design of experiments (DOEs). You'll analyze data with statistics and compile reports with high-level conclusions on technically challenging process engineering experiments. Additionally, you will troubleshoot complex problems, perform root cause analyses, and resolve difficult process engineering and customer product issues. Process Support Engineers work across technologies such as: Chemical Vapor Deposition, Atomic Layer Deposition, Plasma Reactive Ion Etch, Physical Vapor Deposition, Anneal and Implant.
About the Role
We are looking for an experienced Process Support Engineer (PSE) to support Applied Materials KINEX bonding equipment in advanced semiconductor packaging environments. This is a customer-facing role focused on die-to-wafer bonding technologies, supporting high-volume manufacturing through hands-on process engineering and on-site technical support.
Key Responsibilities
Provide on-site technical support for Applied KINEX bonding systems, including installation, qualification, troubleshooting, and process stabilization
Support and optimize die-to-wafer bonding processes for advanced packaging applications
Act as a process owner for Hybrid Bonding technologies, working closely with customer engineering teams
Design and execute process experiments and DOE, analyze data, and deliver clear technical conclusions
Resolve complex equipment and process issues using structured root cause analysis
Collaborate with customers, field service, and internal teams to ensure stable production and yield improvement
Support small-scale technical projects and continuous process improvements
Apply best practices and existing solutions to deliver practical, innovative process solutions
Required Qualifications
Bachelor’s degree in Materials Science, Chemistry, Electrical/Electronics Engineering, Semiconductor Engineering, or related field
3–10 years of experience in semiconductor process engineering, equipment support, or advanced packaging
Strong sense of responsibility, diligence, and ability to perform in physically demanding fab environments
Strong communication and interpersonal skills
English proficiency for technical documentation and global collaboration
Preferred Technical Background / Qualifications
Hybrid Bonding. Die to wafer or wafer to wafer (Fusion bonding)
Plasma related process/ DRY& WET cleaning experience
TC& Flip chip bonding process experience
General backend packaging process experience
Additional:
Master’s degree or PhD in a related field
Experience with Applied Materials KINEX systems
Why Join Us
Work with cutting-edge bonding technologies in advanced semiconductor packaging
High-impact, customer-facing engineering role
Opportunity to become a subject-matter expert in hybrid bonding processes
Dynamic, fast-paced fab environment with technical ownership
Additional Information
Time Type:
Full time
Employee Type:
Assignee / Regular
Travel:
Relocation Eligible:
No
Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.
